Partnership with global companies for equipment enhancement projects and market analysis. Bridge combines deep technical and commercial competences for ensuring the best supprt to the customers and partners.
- Wire Bonding
- Die Bonding
- Flip Chip and Die sorting
- Plasma Cleaning
- Electrical Test
- Laser Technologies
Die Bonding with <10um Repeatability @ 3 sigma
Wire Bonding Equipment for In Line or Stand Alone Process
Full Wire Bonding Range (thin wire, heavy wire, ribbon)
Laser Bonding Equipment for High Current Ribbon
Standard or tailored application development
Manual or Fully Automatic In Line Router for Assembled PCBs
Highest Cutting Accuracy (50um)
Zero Dust Process Compliant with Automotive Market
Turnkey Solution with Loading / Unloading Handling Modules
High Experience in Bond Test Process and attitude to develop Innovative, Modular and Flexible Equipment, are driving XYZTec to lead the market.
More than 50 Test Processes can be processed with XYZTec Platform.
-Rapid heating and cooling rates
-Very good homogeneity heating plates
-Availability of all standard options (HCOOH, H2, Plasma, Flux-trap, Sintering module)
-High degree of automation
-Process control on the module, network capacity, industry 4.0 capability