Partnership with global companies for equipment enhancement projects and market analysis. Bridge combines deep technical and commercial competences for ensuring the best supprt to the customers and partners.

  • Wire Bonding
  • Die Bonding
  • Flip Chip and Die sorting
  • Plasma Cleaning
  • Dispensing
  • Microdispensing
  • Electrical Test
  • Laser Technologies
  • Soldering


Die Bonding with <10um Repeatability @ 3 sigma

Feeding type:

  • Wafer
  • Waffle
  • Jedec
  • T&R






Wire Bonding Equipment for In Line or Stand Alone Process

Full Wire Bonding Range (thin wire, heavy wire, ribbon)

Laser Bonding Equipment for High Current Ribbon

Standard or tailored application development







High Experience in Bond Test Process and attitude to develop Innovative, Modular and Flexible Equipment, are driving XYZTec to lead the market.

More than 50 Test Processes can be processed with XYZTec Platform.




-Rapid heating and cooling rates

-Very good homogeneity heating plates

-Small footprint

-Availability of all standard options (HCOOH, H2, Plasma, Flux-trap, Sintering module)

-High degree of automation

-Process control on the module, network capacity, industry 4.0 capability



-Automation: standard and customized solutions for different markets

-Laser: wide range of processes available like welding, cutting, marking and many more

-Test: from leak test to visual inspection, from electrical to functional tests


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